The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
Author:
Funder
Ministry of Science and Technology
Publisher
Elsevier BV
Subject
General Materials Science
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1. Microstructures of ternary Sn-Bi-xZn alloys on mechanical and electrochemical properties analysis for connection packaging;Journal of Alloys and Compounds;2024-10
2. Effects of Minor Zn Dopants in Sn-10Bi Solder on Interfacial Reaction and Shear Properties of Solder on Ni/Au Surface Finish;Materials;2024-09-03
3. Microstructure evolution and deformation behaviour of Sn-xBi-1Ag Solder alloys: Influences of Bi content;Materials Science and Engineering: A;2024-09
4. Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping;Soldering & Surface Mount Technology;2024-07-31
5. Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders;Journal of Materials Research and Technology;2024-05
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