Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders-Reference-Cited by-同舟云学术

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Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders

Published:2014-12 Issue: Volume:64 Page:15-20
ISSN:0261-3069
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Li L.F.,Cheng Y.K.,Xu G.L.,Wang E.Z.,Zhang Z.H.,Wang H.

Funder

Open Project of State Key Laboratory Cultivation Base for Nonmetal Composites and Functional Materials

Fund of Sichuan Provincial Department of Education

China Scholarship Council

Publisher

Elsevier BV

Subject

Applied Mathematics,General Mathematics

Reference24 articles.

1. Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow;Sharif;Mater Sci Eng B,2004

2. IMC growth and shear strength of Sn–Ag–Bi–In/Au/Ni/Cu BGA joints during aging;Yoon;Mater Trans,2004

3. Current opinion in solid state mater;Suganuma;Science,2001

4. Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys;Noh;J Alloys Compd,2010

5. Properties of lead-free solder alloys with rare earth element additions;Wu;Mater Sci Eng R,2004

Cited by 69 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of individual and synergistic alloying of In and Ni on microstructure, phase stability and thermal properties of lead-free Sn-0.7Cu solder;Philosophical Magazine;2024-07-29

2. Influences of low In alloying and aging on microstructure and plastic deformation behavior of Sn-58Bi solder;Journal of Materials Science: Materials in Electronics;2024-06

3. Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te;Physica Scripta;2024-05-24

4. Effects of In and aging treatment on the microstructure, mechanical properties and electrochemical corrosion behavior of Sn 2Cu solder alloy;Materials Characterization;2024-03

5. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26

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