Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference22 articles.
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3. Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy;El-Daly;Mater Des,2014
4. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys;Liu;J Alloys Compds,2014
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1. The Effect of Extended Dwell Time on Thermal Cycling Performance of Hybrid Low Temperature Solder Joints;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te;Physica Scripta;2024-05-24
3. Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications;Physica Scripta;2024-04-04
4. Long-Term Microstructural Stability of Sn-40Bi and Sn-40Bi-10In Alloys;Journal of Electronic Materials;2024-03-08
5. Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy;Journal of Materials Science: Materials in Electronics;2023-12
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