Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys-Reference-Cited by-同舟云学术

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

Published:2014-01 Issue: Volume:582 Page:229-235
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Liu Chih-Yao,Hon Min-Hsiung,Wang Moo-Chin,Chen Ying-Ru,Chang Kuo-Ming,Li Wang-Long

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference32 articles.

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2. Get the lead out! [lead free solder]

3. Issues in the replacement of lead-bearing solders

4. Improved mechanical properties in new, Pb-free solder alloys

5. Effect of Ag addition on the creep characteristics of Sn–8.8wt%Zn solder alloy

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