Effect of Ag addition on the creep characteristics of Sn–8.8wt%Zn solder alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Tin and Its Alloys and Compounds;Barry,1983
2. Grain Size Dependence of Steady State Creep Rate in Sn-1 wt% Zn Alloy
3. Modelling the creep rates of eutectic Bi–Sn solder using the data from its constitutive phases
4. Anomalous Creep in Sn-Rich Solder Joints
5. The Development and Commercialization of Lead-Free Soldering
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3. Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy;Arab Journal of Nuclear Sciences and Applications;2018-12-09
4. Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder;Journal of Electronic Materials;2018-09-11
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