Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder-Reference-Cited by-同舟云学术

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Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder

Published:2018-09-11 Issue:12 Volume:47 Page:6984-6994
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yassin A. M.,Zahran H. Y.,Abd El-Rehim A. F.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-018-6624-8/fulltext.html

Reference35 articles.

1. A.A. El-Daly, A.E. Hammad, G.A. Al-Ganainy, and A.A. Ibrahiem, Mater. Des. 52, 966 (2013).

2. A.F. Abd El-Rehim, H.Y. Zahran, and S. AlFaify, J. Mater. Eng. Perform. 27, 344 (2018).

3. A.F. Abd El-Rehim and H.Y. Zahran, J. Alloys Compd. 695, 3666 (2017).

4. A.F. Abd El-Rehim and H.Y. Zahran, Mater. Sci. Technol. 30, 434 (2014).

5. P. Pandey, C.S. Tiwary, and K. Chattopadhyay, J. Electron. Mater. 45, 5468 (2016).

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