Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/1743284713Y.0000000372
Reference30 articles.
1. Creep deformation characteristics of tin and tin-based electronic solder alloys
2. Indentation creep study of lead-free Sn–5%Sb solder alloy
3. Effects of aging treatment on mechanical properties and microstructure of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga Solder
4. Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy
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