Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition
Author:
Funder
Department of Education of Liaoning Province
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference15 articles.
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3. Reliability of lead-free solder joints in CSP device under thermal cycling;Zhang;J. Mater. Sci. Mater. Electron.,2014
4. Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets;Huang;J. Mater. Lett.,2016
5. TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows;Liu;J. Mater. Lett.,2016
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