Evolution of deformation near the triple point of grain junctions in Sn-based solders during in situ tensile test
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
1. Lead (Pb)-free solders for electronic packaging
2. Grain boundary sliding in as-cast PbSn eutectic
3. Strain-rate effects on low cycle fatigue mechanism of eutectic Sn–Pb solder
4. Low cycle fatigue test for solders using non-contact digital image measurement system
5. Low cycle fatigue behavior and mechanisms of a eutectic Sn–Pb solder 63Sn/37Pb
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3. Microstructure and its subsequent evolution of Sn37Pb/Cu column interconnect obtained by friction plunge welding;Materials Letters;2019-08
4. Deformation Accommodation at Triple Junctions in Columnar-Grained Nickel;Metallurgical and Materials Transactions A;2018-11-07
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