Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints
Author:
Affiliation:
1. Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow, Poland
2. Academic Centre for Materials and Nanotechnology, AGH University of Science and Technology, Krakow, Poland
Funder
co-funded by the European Regional Development Fund (ERDF) and the Government of Poland under the Innovative Economy Programme
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/13621718.2018.1427836
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1. Structure and properties of lead-free solders bearing micro and nano particles
2. Sn–Zn low temperature solder
3. Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array
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