Anomalous Creep in Sn-Rich Solder Joints-Reference-Cited by-同舟云学术

Anomalous Creep in Sn-Rich Solder Joints

Published:2002 Issue:8 Volume:43 Page:1847-1853
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Song Ho Geon¹,Morris, Jr. John W.¹,Hua Fay²

Affiliation:

1. Department of Materials Science and Engineering, University of California and Center for Advanced Materials, Lawrence Berkeley National Laboratory

2. Materials Technology Operation, Intel Corporation

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/43/8/43_8_1847/_pdf

Reference24 articles.

1. 1) J. W. Morris, Jr. and H.L. Reynolds: Design and Reliability of Solders and Solder Interconnections, ed. by R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw and W. Winterbottom (TMS Soc., Warrendale, PA, 1997) pp. 49–58.

2. 2) M. C. Shine and L. R. Fox: Low Cycle Fatigue, ASTM STP 942, ed. by H. D. Solomon, G. R. Halford, L. R. Kaisand and B. N. Leis (ASTM, Philadelphia, PA, 1988) pp. 588–610.

3. 3) K. Suganuma: MRS Bulletin 26 (2001) 880–884.

4. 4) H. G. Song, J. W. Morris, Jr. and M. T. McCormack: J. Electron. Mater. 29 (2000) 1038–1046.

5. 5) J. L. F. Goldstein and J. W. Morris, Jr.: J. Electron. Mater. 23 (1994) 477–486.

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