Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)
Author:
Funder
Ministry of Higher Education, Malaysia
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
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2. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy;Materials;2022-12-22
3. Effect of Ag and Cu co-addition on the microstructure evolution, interface behavior and mechanical properties of Sn-5Sb based solder joints subjected to different thermal aging conditions;Microelectronics Reliability;2022-12
4. Crystallinity of Co-P coating on microstructure and mechanical properties of Co-Sn intermetallic compounds at Sn-Ag/Co-P/Cu Interface;Materials Characterization;2022-09
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