Author:
Tan C.Y.,Salleh M.A.A. Mohd,Tan X.F.,Yasuda H.,Saud N.,Ramli M.I.I.,Nogita K.
Funder
Universiti Malaysia Perlis
Nihon Superior
Ministry of Higher Education, Malaysia
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference63 articles.
1. Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions;Leong;J. Mater. Sci.: Mater. Electron.,2019
2. The growth behavior of interfacial intermetallic compound between Sn–3.5 Ag–0.5 Cu solder and Cu substrate under different thermal-aged conditions;Xu;J. Mater. Sci.: Mater. Electron.,2017
3. Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging;Wu;J. Mater. Sci. Mater. Electron.,2017
4. M.F. Mohd Sabri, B. Ali, S. Said, High-Temperature Lead-free Solder Materials and Applications, 2019, 31–65.
5. Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys;McDonald;J. Electron. Mater.,2013
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