Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference30 articles.
1. Influence of indium addition on structure, mechanical, thermal and electrical properties of tin–antimony based metallic alloys quenched from melt
2. Creep properties of Sn–Sb based lead-free solder alloys
3. Investigation of multi-component lead-free solders
4. Sub-Microcrystalline Sn and Sn-SnSb Powders as Lithium Storage Materials for Lithium-Ion Batteries
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1. Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling;Journal of Electronic Materials;2024-07-02
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3. Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications;Physica Scripta;2024-04-04
4. Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition;Materials Letters;2024-02
5. Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection;RARE METAL MAT ENG;2023
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