Influence of indium addition on structure, mechanical, thermal and electrical properties of tin–antimony based metallic alloys quenched from melt
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference12 articles.
1. Modification in tin-antimony alloys
2. Electrical resistivity of liquid Sn–Sb alloy
3. Lowering of Sn−Sb alloy melting points caused by substrate dissolution
4. A new proposal for the binary (Sn,Sb) phase diagram and its thermodynamic properties based on a new e.m.f. study
Cited by 28 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Co on microstructure evolution and thermal fatigue stability of lead-free solder alloys of SACBSN series;Microelectronics Reliability;2024-06
2. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09
3. Structural, mechanical and radiation shielding properties of lead and lead-free alloys doped with CuO nanoparticles for radiation protection;Radiation Effects and Defects in Solids;2023-05-08
4. Fabrication, microstructural modifications, elastic properties and radiation attenuation performance of ZnO nano-sized particles-reinforced Pb-based alloys for radiation shielding applications;Radiation Effects and Defects in Solids;2023-02-24
5. The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder;Soldering & Surface Mount Technology;2022-06-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3