Wire Saw Process-Induced Surface Damage Characterization
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://link.springer.com/content/pdf/10.1007/s13369-012-0532-7.pdf
Reference23 articles.
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3. Ge, P.Q.; Zhang, L.; Gao, W.; Liu, Z.C.: Development of endless diamond wiresaw and sawing experiments. Mater. Sci. Forum 471–472, 481–484 (2004)
4. Moller J.H: Basic mechanisms and models of multi—wire sawing. Adv. Eng. Mater. 6(7), 501–513 (2004)
5. Clark W.I., Shih A.J., Hardin C.W., Lemaster R.L., McSpadden S.B: Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force. Int. J. Mach. Tools Manuf. 43, 523–532 (2003)
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