Subject
Mechanical Engineering,Mechanics of Materials,Acoustics and Ultrasonics,Condensed Matter Physics
Reference25 articles.
1. Integrated modeling of wiresaw in wafer slicing;Kao,1998
2. Modeling and experiments on wiresaw for large silicon wafer manufacturing;Kao,1998
3. Vibration of wiresaw manufacturing processes and wafer surface measurement;Kao,1998
4. Modeling stresses of contacts in wiresaw slicing of polycrystalline and crystalline ingots;Li;Journal of Electronics Packaging,1998
5. An integrated approach for analysis and design of wafer slicing by a wire saw;Sahoo;Journal of Electronics Packaging,1998
Cited by
43 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献