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Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers

  • Published:2019-11 Issue: Volume:273 Page:116267
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Xiao Huapan,Wang Hairong,Yu Na,Liang Rongguang,Tong Zhe,Chen Zhi,Wang Jiuhong

Funder

National Natural Science Foundation of China

The National Key Research & Development (R&D) Program of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference50 articles.

1. Ductile-regime grinding: a new technology for machining brittle materials;Bifano;J. Inst. Eng.,1991

2. Influence of grinding parameters on glass workpieces surface finish using response surface methodology;Brient;J. Manuf. Sci. Eng.,2011

3. Depth of cut per abrasive in fixed diamond wire sawing;Chung;Int. J. Adv. Des. Manuf. Technol.,2015

4. Generation of diamond wire sliced wafer surface based on the distribution of diamond grits;Chung;Int. J. Precis. Eng. Manuf.,2014

5. Distribution of diamond grains in fixed abrasive wire sawing process;Chung;Int. J. Adv. Des. Manuf. Technol.,2014

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2. A critical review on the fracture of ultra-thin photovoltaics silicon wafers;Solar Energy Materials and Solar Cells;2024-08

3. Analytical prediction of subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted wire sawing;The International Journal of Advanced Manufacturing Technology;2024-06-08

4. Study on efficient drying process of industrial silicon powder;Environmental Progress & Sustainable Energy;2024-05-28

5. Surface Integrity of Binderless WC Using Dry Electrical Discharge Assisted Grinding;International Journal of Precision Engineering and Manufacturing-Green Technology;2024-04-29
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