Analytical prediction of subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted wire sawing
Author:
Funder
the Natural Science Foundation of Shanghai
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-024-13846-8.pdf
Reference24 articles.
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2. Ozturk S, Aydin L, Kucukdogan N, Celik E (2018) Optimization of lapping processes of silicon wafer for photovoltaic applications. Sol Energy 164:1–11. https://doi.org/10.1016/j.solener.2018.02.039
3. Meißner D, Schoenfelder S, Hurka B, Zeh J, Sunder K (2014) Loss of wire tension in the wire web during the slurry based multi wire sawing process. Sol Energy 120:346–355. https://doi.org/10.1016/j.solmat.2013.05.047
4. Kumar A, Melkote SN (2018) Diamond wire sawing of solar silicon wafers: a sustainable manufacturing alternative to loose abrasive slurry sawing. Procedia Manuf 21:549–566. https://doi.org/10.1016/j.promfg.2018.02.156
5. Costa EC, Xavier FA, Knoblauch R, Binder C, Weingaertner WL (2020) Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw. Sol Energy 207:640–650. https://doi.org/10.1016/j.solener.2020.07.018
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