Author:
Costa Erick Cardoso,Xavier Fabio Antonio,Knoblauch Ricardo,Binder Cristiano,Weingaertner Walter Lindolfo
Subject
General Materials Science,Renewable Energy, Sustainability and the Environment
Reference29 articles.
1. Diamond wire-sawn silicon wafers – from the lab to the cell production;Bidiville,2009
2. Ductile-regime grinding: a new technology for machining brittle materials;Bifano;J. Eng. Ind.,1991
3. Novel texturing process for diamond-wire-sawn single-crystalline silicon solar cell;Chen;Sol. Energy Mater. Sol. Cells,2015
4. Depth of cut per abrasive in fixed diamond wire sawing;Chung;Int. J. Adv. Manuf. Technol.,2015
5. Influence of diamond wire sawing parameters on subsurface microcracks formation in monocrystalline silicon wafer;Costa,2019
Cited by
43 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献