Fractal analysis on the surface topography of Monocrystalline silicon wafers sawn by diamond wire

Author:

Liu Tengyun,Zhang Peirong,Su Yancai,Sun Yujing

Publisher

Elsevier BV

Reference38 articles.

1. Photovoltaic cell defect classification based on integration of residual-inception network and spatial pyramid pooling in electroluminescence images;Hakan;Expert Syst. Appl.,2023

2. Study on surface characteristics of as-sawn sapphire crystal wafer considering diamond saw wire wear;Zhu;Wear,2023

3. Effect of the diamond saw wires capillary adhesion on the thickness variation of ultra-thin photovoltaic silicon wafers during slicing;Cheng;Sol. Energy Mater. Sol. Cell.,2023

4. Modeling and experimental investigation of monocrystalline silicon wafer cut by diamond wire saw;Wang;Eng. Fract. Mech.,2023

5. Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing;Wang;Eng. Fract. Mech.,2021

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