Author:
Clark W.I.,Shih A.J.,Hardin C.W.,Lemaster R.L.,McSpadden S.B.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference47 articles.
1. Study on machining characteristics of diamond abrasive wire;Ito;Journal of Mechanical Engineering Lab, Tokyo, Japan,1987
2. Cutting performance of diamond plated wire tools;Tokura;Journal of Japan Society of Precision Engineering,1992
3. Study on machining characteristics of wire tool with electrodeposited diamond grains;Ishikawa;Transactions of Japan Society of Mechanical Engineers,1994
4. Modeling stresses of contacts in wire saw slicing of polycrystalline and crystalline ingots: application to silicon wafer production;Li;ASME Journal of Electronic Packaging,1998
5. Towards an integrated approach for analysis and design of wafer slicing by a wire saw;Sahoo;ASME Journal of Electronic Packaging,1998
Cited by
118 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献