Wire bow analysis based on process parameters in diamond wire sawing-Reference-Cited by-同舟云学术

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Wire bow analysis based on process parameters in diamond wire sawing

Published:2023-11-21 Issue: Volume: Page:
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Guo Yufeng,Gao Yufei,Zhang Xingchun,Shi Zhenyu

Funder

Natural Science Foundation of Shandong Province

National Natural Science Foundation of China

National Key Research and Development Project

Outstanding Youth Fund of Shandong Natural Science Foundation

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

https://link.springer.com/content/pdf/10.1007/s00170-023-12659-5.pdf

Reference29 articles.

1. Cheng DM, Gao YF (2022) Finite element analysis of the clamping stress of photovoltaic silicon brick in diamond wire sawing. Mater Sci Semicond Process 147. https://doi.org/10.1016/j.mssp.2022.106732

2. Huang H, Zhang YX, Xu XP (2015) Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire. Int J Adv Manuf Technol 81(5-8):955–965. https://doi.org/10.1007/s00170-015-7250-8

3. Cheng DM, Gao YF, Yang CF (2022) Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon. Mater Sci Semicond Process 144. https://doi.org/10.1016/j.mssp.2022.106602

4. Clark WI, Shih AJ, Hardin CW, Lemaster RL, McSpadden SB (2003) Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force. Int J Mach Tools Manuf 43(5):523–532. https://doi.org/10.1016/S0890-6955(02)00215-8

5. Wu Q, Liu ZD, Shen LD, Yue WD, Zhang B (2017) Test research on wire deflection detection of a diamond wire saw. Int J Adv Manuf Technol 91:1347–1354. https://doi.org/10.1007/s00170-016-9787-6

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