Author:
Huang Hui,Zhang Yuxing,Xu Xipeng
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference18 articles.
1. Friedrichs P, Kimoto T, Ley L, Pensl G (2009) Silicon carbide, vol 1: growth, defects, and novel applications. Wiley-VCH Verlag GmbH&Co KGaA, Weinheim. doi: 10.1002/ 9783527629053
2. Power devices and sensors;P Friedrichs,2009
3. Hsu CY, Chen CS, Tsao CC (2009) Free abrasive wire saw machining of ceramics. Int J Adv Manuf Technol 40:503–511. doi: 10.1007/s00170-007-1355-7
4. Guimarães L, Santos R, Lobo BA (2011) Scheduling wafer slicing by multi-wire saw manufacturing in photovoltaic industry: a case study. Int J Adv Manuf Technol 53:11293–1139. doi: 10.1007/s00170-010-2906-x
5. Chung CH, Tsay GD, Tsai MH (2014) Distribution of diamond grains in fixed abrasive wire sawing process. Int J Adv Manuf Technol 73:1485–1494. doi: 10.1007/s00170-014-5782-y
Cited by
48 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献