Author:
Hsu C. Y.,Chen C. S.,Tsao C. C.
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference14 articles.
1. Hsu CY (2000) The study of wire saw machining (in Chinese). Doctoral Thesis University of Taiwan
2. Bhagavat S, Kao I (2006) Theoretical analysis on the effects of crystal anisotropy on wiresawing process and application to wafer slicing. Int J Mach Tools Manuf 46(5):531–541
3. Yamamoto T (1995) Multi-wire slabbing of granite. Ind Diam Rev 55(567):179–181
4. Contardi GL (1993) Wire saw beads economic production. Ind Diam Rev 53(558):256–260
5. Kojima M (1990) Development of new wafer slicing equipment. Sumitomo Met 42(4):218–224
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献