Theoretical analysis on the effects of crystal anisotropy on wiresawing process and application to wafer slicing
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference33 articles.
1. Modeling stresses of contacts in wiresaw slicing of polycrystalline and crystalline ingots: application to silicon wafer production;Li;Journal of Electronic Packaging,1998
2. Computational model for free abrasive machining of brittle silicon using a wiresaw;Bhagavat,1999
3. Elasto–hydrodynamic interaction in the free abrasive wafer slicing using a wiresaw: modeling and finite element analysis;Bhagavat;Journal of Tribology,2000
4. Towards an integrated approach for analysis and design of wafer slicing by a wire saw;Sahoo;Journal of Electronic Packaging,1998
5. Vibration analysis of wire and frequency response in the modern wiresaw manufacturing process;Wei;Journal of Sound and Vibration,2000
Cited by 32 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon;Micromachines;2023-07-27
2. Prediction and verification of wafer surface morphology in ultrasonic vibration assisted wire saw (UAWS) slicing single crystal silicon based on mixed material removal mode;The International Journal of Advanced Manufacturing Technology;2022-04-18
3. Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw;Materials Science in Semiconductor Processing;2021-10
4. Influence of diamond wire saw slicing parameters on (010) lattice plane beta-gallium oxide single crystal wafer;Materials Science in Semiconductor Processing;2021-10
5. Modeling of the Wiresaw Manufacturing Process and Material Characteristics;Wafer Manufacturing;2021-01-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3