Assessment of sustainable and machinable performance metrics of monocrystalline silicon carbide wafer with electrophoretic-assisted multi-diamond wire sawing
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-024-13664-y.pdf
Reference52 articles.
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4. Feng Y, Li K, Dou Z et al (2022) High-speed dicing of sic wafers with 0.048 mm diamond blades via rolling-slitting. Mater 15(22):8083. https://doi.org/10.3390/ma15228083
5. Yin Y, Gao Y, Yang C (2021) Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle. Ceram Int 47(19):26627–26634. https://doi.org/10.1016/j.ceramint.2021.06.070
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