1. Xie ZH, Wei X, Huang RW (2004) Semiconductor wafer diamond tool cutting technology. Diam Abrasives Eng:10–14
2. Yukari I, Yao YZ, Yoshihiro S (2014) Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive wire sawing, with fixed abrasive, and electric discharge machining. Jpn J Appl Phys 071301:1–11
3. Satoshi I, Ryoji M (1987) Study on machining characteristics of diamond abrasive wire. Journal of mechanical engineering lab. Tokyo, Jpn 41(5):236–244
4. Clark WI, Shih AJ, Hardin CW, Lemaster RL, Mcspadden SB (2003) Fixed abrasive diamond wire machining—part I: process monitoring and wire tension force. Int J Mach Tools Manuf 43(5):523–532
5. Egemen T (2008) Mechanics of wire saw machining process: experimental analyses and modeling. Ames, Iowa State University