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Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

  • Published:2020-06 Issue: Volume:112 Page:105015
  • ISSN:1369-8001
  • Container-title:Materials Science in Semiconductor Processing
  • language:en
  • Short-container-title:Materials Science in Semiconductor Processing

Author:

Wang Liyuan,Gao Yufei,Li Xinying,Pu Tianzhao,Yin Youkang

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shandong Province, China

Key Research and Development Program of Shandong Province, China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference39 articles.

1. Effect of growth rate and wafering on residual stress of diamond wire sawn silicon wafers;Kumar;Procedia. Man.,2016

2. Fracture strength of silicon wafers sawn by fixed diamond wire saw;Liu;Sol. Energy,2017

3. Effect of crystal defects on mechanical properties relevant to cutting of multicrystalline solar silicon;Wu;Mater. Sci. Semicond. Process.,2013

4. Research of the cutting marks on diamond wire cut multicrystalline silicon wafers and the method to remove them;Chen;J. Synth. Cryst.,2014

5. Diamond wire sawing of solar silicon wafers: a sustainable manufacturing alternative to loose abrasive slurry sawing;Kumar;Procedia. Man.,2018

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1. A critical review on the fracture of ultra-thin photovoltaics silicon wafers;Solar Energy Materials and Solar Cells;2024-08

2. Analytical prediction of subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted wire sawing;The International Journal of Advanced Manufacturing Technology;2024-06-08

3. Modeling and optimizing of laser-assisted waterjet process parameters for near-damage-free micromachining of monocrystalline silicon;Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture;2024-04-22

4. Experimental study on the formation mechanism of saw marks in wire sawing;International Journal of Mechanical Sciences;2024-03

5. Multi-objective optimization of energy consumption, surface roughness, and material removal rate in diamond wire sawing for monocrystalline silicon wafer;The International Journal of Advanced Manufacturing Technology;2023-10-17
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