Effect of Aging on Dendritic Array, Ag3Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy-Reference-Cited by-同舟云学术

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Effect of Aging on Dendritic Array, Ag3Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy

Published:2022-06-07 Issue:8 Volume:51 Page:4640-4648
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Silva Bismarck Luiz^ORCID,Mendes Pedro Henrique,Garcia Amauri,Spinelli José Eduardo

Funder

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior

Conselho Nacional de Desenvolvimento Científico e Tecnológico

Fundação de Amparo à Pesquisa do Estado de São Paulo

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-09713-5.pdf

Reference30 articles.

1. S. Amore, E. Ricci, G. Borzone, and R. Novakovic, Wetting Behaviour of Lead-Free Sn-Based Alloys on Cu and Ni Substrates. Mater. Sci. Eng. A 495, 108 (2008).

2. P. Fima, T. Gancarz, J. Pstrus, K. Bukat, and J. Sitek, Thermophysical Properties and Wetting Behavior on Cu of Selected SAC Alloys. Solder. Surf. Mt. Technol. 24, 71 (2012).

3. D.A. Shnawah, M.F.M. Sabri, and I.A. Badruddin, A Review on Thermal Cycling and Drop Impact Reliability of SAC Solder Joint in Portable Electronic Products. Microelectron. Reliab. 52, 90 (2012).

4. W.N.C. Weng, Evolution of Pb-Free Solders. IntechOpen (2017). https://doi.org/10.5772/intechopen.69553.

5. J.B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, and F. Dulondel, Microstructural Evolutions of Sn-3.0Ag-0.5Cu Solder Joints During Thermal Cycling. Microelectron. Reliab. 83, 64 (2018).

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1. Quantitative Microstructural Data of Bulk Solders and Joints under a New Framework of MicroStructure Hierarchy Descriptor (μSHD);2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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