Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling-Reference-Cited by-同舟云学术

Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling

Published:2018-04 Issue: Volume:83 Page:64-76
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Libot J.B.,Alexis J.,Dalverny O.,Arnaud L.,Milesi P.,Dulondel F.

Funder

University of Toulouse and Safran Electronics & Defense

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

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2. Solder joint fatigue model: review and applicability chip scale packages;Lee;Microelectron. Reliab.,2000

3. Microstructural Changes Under Isothermal Aging and Their Influence on Thermal Fatigue Reliability for Tin-lead and Lead-free Solder Joints, Including Microstructural Changes Under Isothermal Aging in Mixed Solder Joints;Choubey,2007

4. Multiscale Modeling of the Anisotropic Transient Creep Response of Heterogeneous SAC Single Crystal;Mukherjee,2015

5. Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size, Cyclic Strain and Microstructure;Barbini,2011

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