Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
1. Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes
2. Surface and transport properties of Au–Sn liquid alloys
3. Modeling reactive wetting
4. Lead-free Solders in Microelectronics
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3. Non-wetting to Wetting Transition Temperatures of Liquid Tin on Surfaces of Different Steel Samples Corresponding to their Spontaneous Deoxidation;Archives of Metallurgy and Materials;2023-07-26
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5. Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures;Soldering & Surface Mount Technology;2023-06-05
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