Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
1. Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes
2. Surface and transport properties of Au–Sn liquid alloys
3. Modeling reactive wetting
4. Lead-free Solders in Microelectronics
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3. Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions;Electronic Materials Letters;2024-04-13
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