Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes-Reference-Cited by-同舟云学术

Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes

Published:2006-01-15 Issue:2 Volume:99 Page:023530
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Vuorinen V.,Laurila T.,Yu H.,Kivilahti J. K.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2166647

Reference41 articles.

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4. V. F. Hribar, J. L. Bauer, and T. P. O’Donnell, Proceedings of the Third International SAMPE Electronics Conference, 20–22 June 1989, Los Angeles, CA (Society for the Advancement of Material and Process Engineering, Covina, CA, 1989), pp. 1187–1199.

5. Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets

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