Thermophysical properties and wetting behavior on Cu of selected SAC alloys-Reference-Cited by-同舟云学术

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Published:2012-04-06 Issue:2 Volume:24 Page:71-76
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Fima Przemyslaw,Gancarz Tomasz,Pstrus Janusz,Bukat Krystyna,Sitek Janusz

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference25 articles.

1. Effect of flux on the wetting characteristics of SnAg, SnCu, SnAgBi, and SnAgCu lead-free solders on copper substrates

2. Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

3. Development and validation of lead‐free wave soldering process

4. A Comparison of Surface Tension, Viscosity, and Density of Sn and Sn–Ag Alloys Using Different Measurement Techniques

5. Gasior, W., Moser, Z., Pstrus, J., Bukat, K., Kisiel, R. and Sitek, J. (2004), “(Sn‐Ag) eut+Cu soldering materials, part I: wettability studies”,Journal of Phase Equilibria and Diffusion, Vol. 25, pp. 115‐21.

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