(Sn-Ag)eut+Cu soldering materials, part I: Wettability studies

Author:

Gasior W.,Moser Z.,Pstruś J.,Bukat K.,Sitek J.,Kisiel R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Condensed Matter Physics

Reference17 articles.

1. J.A.V. Butler: “The Thermodynamic of the Surfaces of Solutions,” Proc. R. Soc., 1932, 135A, p. 375.

2. J. Glazer: “Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assambly: A Review,” J. Electron. Mater., 1994, 23, pp. 693–700.

3. C.M. Miller, I.E. Anderson, and J.F. Smith: “A Viable Tin-Lead Solders Substitute: Sn-Ag-Cu,” J. Electron. Mater., 1994, 23, p. 595.

4. M. Mizyaki, M. Mizutani, T. Takemoto, and A. Matsunawa: “Conditions for Measurements of Surface Tension of Solders with a Wetting Balance Tester,” Trans. JWRI, 1997, 26, pp. 81–84.

5. H.M. Lee, S.W. Yoon, and B-J Lee: “Thermodynamic Prediction of Interface at Cu/Solder Joints,” J. Electron. Mater., 1998, 27, pp. 1161–66.

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