Development and validation of lead‐free wave soldering process-Reference-Cited by-同舟云学术

Development and validation of lead‐free wave soldering process

Published:2000-12 Issue:3 Volume:12 Page:29-34
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Forstén Atso,Steen Hector,Wilding Ian,Friedrich Jürgen

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference9 articles.

1. Artaki, I., Finley, D.W. Jackson, A.M. and Ray, U. (1995), “Wave soldering with lead‐free solders”,Proceedings of the SMI Conference on Advanced Electronics Manufacturing Technology, San Jose, 1995, pp. 495‐510.

2. Surface oxidation of molten soft solder: An Auger study

3. Gickler, A. Loomans, M. and Willi, C. (1997), “Contamination of lead‐free solders with copper and lead”,Surface Mount Technology, pp. 44‐8.

4. Jacobson, D.M. and Harrison, M. (1997), “Lead‐free soldering: a progress report”,GEC Journal of Research, Vol. 14 No. 2, pp. 98‐109.

5. Über das Anlaufverhalten von flüssigen Zinn-Blei-Loten

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