Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps-Reference-Cited by-同舟云学术

Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps

Published:2004-10 Issue:10 Volume:33 Page:1130-1136
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Wang S. J.,Kao H. J.,Liu C. Y.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0114-x.pdf

Reference18 articles.

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4. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson, J. Appl. Phys. 85, 8456 (1999).

5. Z. Mei, P. Callery, D. Fisher, F. Hua, and J. Glazer, Advances in Electronic Packaging, Proc. Pacific Rim/ASME Int. Intersociety Electronic Photonic Packaging Conf. (New York: ASME, 1997), pp. 543–1550.

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