On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150–210 °C

Author:

Taneja Divya,Volpert Marion,Hodaj Fiqiri

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference53 articles.

1. Solder Joint Technology: Materials, Properties, and Reliability;Tu,2007

2. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R,2002

4. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater. Sci. Eng. R,2005

5. Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillars;Bertheau;Intermetallics,2014

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