On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150–210 °C
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference53 articles.
1. Solder Joint Technology: Materials, Properties, and Reliability;Tu,2007
2. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R,2002
4. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater. Sci. Eng. R,2005
5. Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillars;Bertheau;Intermetallics,2014
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105–0.3Ti solder joints;Materials Characterization;2024-09
2. Fabrication and Tribological Properties of 60niti-Based Bionic Surface Texture Self-Lubricating Surfaces Via Selective Laser Melting and Infiltration;2024
3. Interfacial Reaction and Strengthening Mechanism of Thermo-Compression Bonding Foam Ni Reinforced Sac105 and Sac105-0.3ti Solder Joints;2024
4. Wetting behavior and mechanical properties of Sn-10Sb solder/Ni-plated Cu system with different surface structures;Vacuum;2023-11
5. Amorphization and intermetallic nucleation in early-stage interfacial diffusion during Sn-solder/Ni solid-state bonding;Journal of Alloys and Compounds;2021-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3