1. 3D chip stacking technology with low-volume lead-free interconnections;Sakuma,2007
2. Study of 15 μm pitch solder microbumps for 3D IC integration;Yu,2009
3. Characterization of micro-bump C4 interconnects for Si-carrier SOP applications;Wright,2006
4. Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: the fabrication, assembly and characterization;Gan,2006
5. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater Sci Eng R,2005