Size effects on IMC growth of Cu/Ni/Sn-3.5Ag microbump joints during isothermal aging and prediction of shear strength using ANN
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
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4. Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding;Materials Characterization;2024-01
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