Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications-Reference-Cited by-同舟云学术

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Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications

Published:2015-04 Issue: Volume:629 Page:16-21
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Yu J.J.,Yang C.A.,Lin Y.F.,Hsueh C.H.,Kao C.R.

Funder

National Science Council

National Taiwan University

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference21 articles.

1. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

2. A 3-D stacked chip packaging solution for miniaturized massively parallel processing

3. Demystifying 3D ICs: The Pros and Cons of Going Vertical

4. J.H. Lau, TSV manufacturing yield and hidden costs for 3D IC integration, in: Proceedings of IEEE Electronic Components and Technology Conference, 2010, pp. 1031–1042.

5. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

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1. Microstructure modification and mechanical reinforcement in sub-10 μm scale Cu/Sn–Ag/Cu microbump joints via Co-addition of Zn and Ni in Cu substrates;Materials Chemistry and Physics;2024-11

2. Diffusion bonding among hard alloy, tool steel, and alloy steel by hot isostatic pressing: Interfacial microstructure and mechanical properties;International Journal of Refractory Metals and Hard Materials;2024-01

3. Microstructure evolution and thermal, wetting, mechanical properties of SiC nanowires reinforced SAC105 composite solder;Intermetallics;2023-03

4. Microstructural and mechanical integrity of Cu/Cu joints formed through transient liquid bonding with Cu-Sn nanocomposite interlayer;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

5. Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite;Materials Today Communications;2022-12

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