A 3-D stacked chip packaging solution for miniaturized massively parallel processing-Reference-Cited by-同舟云学术

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A 3-D stacked chip packaging solution for miniaturized massively parallel processing

Published:1999 Issue:3 Volume:22 Page:424-432
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Lea R.M.,Jalowiecki I.P.,Boughton D.K.,Yamaguchi J.S.,Pepe A.A.,Ozguz V.H.,Carson J.C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/17029/00784496.pdf?arnumber=784496

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