Alternating reaction phases in Sn–Cu/Ni–Co solid-state reactions
Author:
Funder
National Science Council
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
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2. Stacking-disordered CoSn3 and tetragonally stacked CoSn4 formed during solid-state interdiffusion of Co and Sn;Intermetallics;2023-09
3. Enhance Mechanical Property and Electrical Conductivity Simultaneously of Sn-Cu-Co Solder Alloys by Directional Solidification;2023
4. Enhancing the shear strength of the Au–Ge solder joint via forming a ductile face-centered cubic solid solution layer at the interface;Journal of Materials Research and Technology;2022-07
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