Isothermal solid-state aging of Pb–5Sn solder bump on Ni/Cu/Ti under bump metallization
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. Flip Chip Technologies;Lau,1996
2. Tin–lead (SnPb) solder reaction in flip chip technology
3. Physics and materials challenges for lead-free solders
4. Effects of substrate metallizations on solder/underbump metallization interfacial reactions in flip-chip packages during thermal aging
5. Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09
2. Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes;Transactions of The Japan Institute of Electronics Packaging;2024
3. Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging;Journal of Electronic Materials;2023-10-22
4. Elucidation of the capillarity-promoted sintering of silver nanoparticles produced by a spark ablation vapor source;Advanced Powder Technology;2023-04
5. Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging;ACS Applied Electronic Materials;2022-07-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3