Isothermal solid-state aging of Pb–5Sn solder bump on Ni/Cu/Ti under bump metallization
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. Flip Chip Technologies;Lau,1996
2. Tin–lead (SnPb) solder reaction in flip chip technology
3. Physics and materials challenges for lead-free solders
4. Effects of substrate metallizations on solder/underbump metallization interfacial reactions in flip-chip packages during thermal aging
5. Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction
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