Author:
Ma Limin,Wang Yuchen,Jia Qiang,Zhang Hongqiang,Wang Yishu,Li Dan,Zou Guisheng,Guo Fu
Funder
National Natural Science Foundation of China
Beijing Municipal Education Commission
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference35 articles.
1. S.R. Esa, G. Omar, S.H. Sheikh, M. Fadzullah, and B. Out, Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology. Int. J. Nanoelectron. M. 13, 461–472 (2020).
2. H. Zhang, H. Zhang, Q. Jia, C. Yin, Z. Deng, W. Guo, and Z. Wan, Novel SiC-based power device bonding materials of nano foam sheet and its characteristic and properties. IEEE T Electron. Pack. (2023). https://doi.org/10.1109/tcpmt.2023.3288389.
3. Lei, G. Thermomechanical reliability of low-temperature sintered attachments on direct bonded aluminum (DBA) substrate for high-temperature electronics packaging. Virginia Tech, (2010).
4. G. Qu, Z. Deng, W. Guo, Z. Peng, Q. Jia, E. Deng, and H. Zhang, The heat-dissipation sintered interface of power chip and heat sink and its high-temperature thermal analysis. IEEE T. Electron. Pack. (2023). https://doi.org/10.1109/tcpmt.2023.3290303.
5. C.M. Chen, K.J. Wang, and K.C. Chen, Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization. J. Alloy. Compd. 432, 122–128 (2007). https://doi.org/10.1016/j.jallcom.2006.05.116.