1. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging;M Xin;Journal of Materials Science: Materials in Electronics,2022
2. Development of low temperature Cu-Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC);H Hu;Microelectronics and Reliability,2021
3. Structure and properties of Sn-Cu lead-free solders in electronics packaging;M Zhao;Science and Technology of Advanced Materials,2019
4. Suppression of Cu 3 Sn in the Sn-10Cu peritectic alloy by the addition of Ni;S U Mehreen;Journal of Alloys and Compounds,2018
5. Intense Pulsed Light Soldering of Sn-3.0Ag-0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface-Finished Printed Circuit Board and Its Drop Impact Reliability;E Ha;Advanced Engineering Materials,2023