Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni
Author:
Funder
University of Queensland
JSPS
Australian Postgraduate Award
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference49 articles.
1. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014
2. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001
3. Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications;Andersson;J. Alloys Compd.,2008
4. Solder Joint Technology: Materials, Properties, and Reliability;Tu,2007
5. Development of high-temperature solders: review;Zeng;Microelectron. Reliab.,2012
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