Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Lead-free Solders in Microelectronics
2. Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy
3. Properties of lead-free solder alloys with rare earth element additions
4. http://www.nemi.org/projects/ese/if_assembly.html.
5. http://www.metalprices.com/FreeSite/metals/ag/ag.asp.
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