Novel Sn-0.7Cu composite solder reinforced with ultrafine nanoscale nickel particles/porous carbon-Reference-Cited by-同舟云学术

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Novel Sn-0.7Cu composite solder reinforced with ultrafine nanoscale nickel particles/porous carbon

Published:2022-12 Issue: Volume:194 Page:112414
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Lin Bo,Lu Guoge,Wang Hao,Yuan Junzhuo,Wei Fuxiang,Sui Yanwei,Qi Jiqiu,Meng Qingkun,Ren Yaojian

Funder

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference44 articles.

1. Experimental investigation on the sintering kinetics of Nanosilver particles used in high-power electronic packaging;Fan;IEEE Trans. Compon. Packag. Manuf. Technol.,2020

2. Reliability assessment of flip chip interconnect electronic packaging under thermal shocks;Su,2020

3. Chen-Wiegart, designing multiscale porous metal by simple dealloying with 3D morphological evolution mechanism revealed via X-ray nano-tomography;Zou;ACS Appl. Mater. Interfaces,2020

4. Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging;Choi;J. Electron. Mater.,1999

5. Vibration-fracture resistance of Sn-Pb and Sn-Ag eutectic solders;Chuang;Mater. Trans.,2001

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder;Journal of Materials Science: Materials in Electronics;2024-07

2. Site-selective core/shell deposition of tin on multi-segment nanowires for magnetic assembly and soldered interconnection;Nanotechnology;2024-06-14

3. Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper;Heliyon;2024-03

4. Effect of Trace Boron Nitride Nanoparticles on the Microstructure and Shear Properties of Sn58Bi Solder Joint;Journal of Materials Engineering and Performance;2023-08-23

5. Melting Characteristic, Wettability, Interfacial Reaction, and Shear Property of Ball Grid Array Structure Cu/Sn_0.3Ag_0.7Cu/Cu Solder Joints With Ni-Modified Carbon Nanotubes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08

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