Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder-Reference-Cited by-同舟云学术

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Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder

Published:2023-09-11 Issue: Volume:31 Page:1-4
ISSN:
Container-title:2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
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Author:

Harvey David M.¹,Manzanera Teresa Partida²,Baishya Kangkana³,Zhang Guangming¹,Arif Mohd Arif Anuar Mohd Salleh⁴,Chan Y. C.⁵,Ekere Nduka⁵,Braden Derek⁶

Affiliation:

1. General Engineering Research Institute, Liverpool John Moores University,Liverpool,UK

2. University of Liverpool,Liverpool,UK

3. Assam Engineering College,Guwahati,India

4. UniMAP,Perlis,Malaysia

5. Liverpool John Moores University,Liverpool,UK

6. Aptiv,Coventry,UK

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418436.pdf?arnumber=10418436

Reference25 articles.

1. Superplastic deformation of the Pb-Sn eutectic

2. Ductility of the superplastic Pb-Sn eutectic at room temperature

3. High-strain fatigue of Pb-Sn eutectic solder alloy;H.;J. Mater. Sci.,1996

4. Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

5. Directive 2002/95/EC: Restriction of the use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS);Off. J Eur. Union,2003

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